Thermal printing head

A thermal printing head of a printing apparatus is provided. The thermal printing head includes an alumina substrate on which a plurality of heat resistors and signal supplying aluminum pattern elements are formed, a print circuit board for supplying an electric signal and power to the heat resistor...

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Bibliographic Details
Main Authors PARK; SUNG-SOO, YANG; HONG-GEUN
Format Patent
LanguageEnglish
Published 28.04.1998
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CORRECTION OF TYPOGRAPHICAL ERRORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A thermal printing head of a printing apparatus is provided. The thermal printing head includes an alumina substrate on which a plurality of heat resistors and signal supplying aluminum pattern elements are formed, a print circuit board for supplying an electric signal and power to the heat resistors, which is located adjacent to the alumina substrate, a heat sink for discharging heat, wherein the heat sink is attached to the bottom of the print circuit board and the alumina substrate; and a driving IC mounted on the alumina substrate, each signal supplying aluminum pattern element thereof being formed of two portions having different widths which are alternately connected in a lengthwise direction along the signal supplying aluminum pattern. This arrangement minimizes or prevents contamination of the wire bonding pad due to bleeding of solder resist and non-conductive epoxy along the signal supplying aluminum pattern element during manufacturing processes.
Bibliography:Application Number: US19960743148