Aluminum nitride sintered body with high thermal conductivity and its preparation
PCT No. PCT/US94/04256 Sec. 371 Date Dec. 7, 1995 Sec. 102(e) Date Dec. 7, 1995 PCT Filed Apr. 18, 1994 PCT Pub. No. WO95/02563 PCT Pub. Date Jan. 26, 1995An aluminum nitride sintered product with a high thermal conductivity (at least 100 W/m.K) can be prepared at a sintering temperature of less tha...
Saved in:
Main Authors | , , , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
28.04.1998
|
Edition | 6 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PCT No. PCT/US94/04256 Sec. 371 Date Dec. 7, 1995 Sec. 102(e) Date Dec. 7, 1995 PCT Filed Apr. 18, 1994 PCT Pub. No. WO95/02563 PCT Pub. Date Jan. 26, 1995An aluminum nitride sintered product with a high thermal conductivity (at least 100 W/m.K) can be prepared at a sintering temperature of less than 1850 DEG C. (often less than 1650 DEG C.) using a sinterable combination of aluminum nitride powder with at least three sintering aids. The sintering aids include a source of a rare earth metal oxide, a source of an alkaline earth metal oxide, a boron source and, optionally, a source of aluminum oxide. The sinterable combinations may also be used to prepare cofired, multilayer substrates. |
---|---|
Bibliography: | Application Number: US19950557025 |