Apparatus for cleaning semiconductor wafers

A method of cleaning a semiconductor wafer comprises placing liquid in a bath with a gas-liquid-interface defined at the surface of the liquid. A semiconductor wafer is placed in the bath so that it is oriented in a generally upright position with at least part of the wafer being in the liquid and b...

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Bibliographic Details
Main Authors BARTRAM; RONALD D, CHAI; JING, ERK; HENRY F, HOLLANDER; EUGENE R
Format Patent
LanguageEnglish
Published 06.05.1997
Edition6
Subjects
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Summary:A method of cleaning a semiconductor wafer comprises placing liquid in a bath with a gas-liquid-interface defined at the surface of the liquid. A semiconductor wafer is placed in the bath so that it is oriented in a generally upright position with at least part of the wafer being in the liquid and below the gas-liquid-interface. Sonic energy is directed through the liquid. At least one of the position of the semiconductor wafer and the level of liquid in the bath relative to the semiconductor wafer is varied so that the entire surface of the wafer repeatedly passes through the gas-liquid-interface.
Bibliography:Application Number: US19960686367