Manufacturing method for double-sided wiring board

A photosensitive insulation bonding layer is formed on a conducting layer. The photosensitive insulation bonding layer is subjected to exposure treatment to produce an exposed area and an unexposed area. Another conducting layer is formed on the outer surface of the photosensitive insulation bonding...

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Bibliographic Details
Main Authors AKAMA; FUMIO, TANAKA; YASUYUKI
Format Patent
LanguageEnglish
Published 21.01.1997
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CINEMATOGRAPHY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
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Summary:A photosensitive insulation bonding layer is formed on a conducting layer. The photosensitive insulation bonding layer is subjected to exposure treatment to produce an exposed area and an unexposed area. Another conducting layer is formed on the outer surface of the photosensitive insulation bonding layer which has undergone the exposure treatment, then both conducting layers are photoetched to produce desired wiring patterns. In the next step, the unexposed area is removed from the photosensitive insulation bonding layer by development so as to form an access opening for connecting a circuit component to the wiring patterns. Then, the exposed area of the photosensitive insulation bonding layer is turned into an insulating layer by curing.
Bibliography:Application Number: US19950387291