Method and apparatus for assembling multichip modules

• Main Authors: DEGANI; YINON, DUDDERAR; THOMAS D, TAI; KING L
• Format: Patent
• Language: English
• Published: 15.10.1996
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such a multichip module. The disclosed assembly process makes the heretofore difficult a...