Method and apparatus for assembling multichip modules

A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such a multichip module. The disclosed assembly process makes the heretofore difficult a...

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Bibliographic Details
Main Authors DEGANI; YINON, DUDDERAR; THOMAS D, TAI; KING L
Format Patent
LanguageEnglish
Published 15.10.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such a multichip module. The disclosed assembly process makes the heretofore difficult and expensive flip chip bonding technique achievable at low cost. The flip chip bonding technique is simplified by use of a solder paste which includes desirable reflow alignment, fluxing and printability characteristics. These desirable characteristics allow the assembly process to be further economically achieved by permitting the use of standard surface mount equipment in the process. High volume production of standard inexpensive modules are thus possible through this process while also achieving the advantage of high density interconnections afforded through the flip-chip bonding technology.
Bibliography:Application Number: US19950479587