Method and apparatus of mounting a package housing and ground strap

• Main Authors: LANTING; MARK L, PATTERSON; JACK D, FRITZ; TODD W, DAVIS; ALAN R, EDELEN; STEPHEN A
• Format: Patent
• Language: English
• Published: 20.02.1996
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LINE CONNECTORS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

A ground strap and vibration mount assembly (10) effectively mechanically isolates an electronic component from vibration while also providing an electrically conductive path to ground potential. The assembly (10) includes a vibration dampener (16) mounted through an opening (28) formed in a tab (12) projecting from the housing of the vibration sensitive electronic component. An insert (18) is provided therein and a mounting bolt (54) is positioned through a suitable opening (36) formed through the insert (18). An electrically conductive ground strap (40) is wrapped partially around the tab (12). An aperture (52) is formed in one portion (50) of the strap (40) and the bolt (54) passed therethrough. Opposing ends (42) of the electrically conductive connector (40) are secured to the tab (12).