Moisture removal and passivation of surfaces
The present invention is a process of removal of moisture from surfaces, such as metal conduit for transmission of high purity gases in electronic component fabrication facilities, and the passivation of such metal surfaces to retard the readsorption of moisture, wherein the moisture removal and pas...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
02.01.1996
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | The present invention is a process of removal of moisture from surfaces, such as metal conduit for transmission of high purity gases in electronic component fabrication facilities, and the passivation of such metal surfaces to retard the readsorption of moisture, wherein the moisture removal and passivation is enhanced using an agent of the formula: RaSiXbYcZd where a =1-3; b, c, and d are individually 0-3 and a+b+c+d=4; R is one or more organic groups; and at least one of X, Y or Z have a bond to silicon that is readily hydrolyzable. The moisture removal and passivation is conducted at less than 65 DEG C. and at least ambient pressure. |
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Bibliography: | Application Number: US19940329029 |