Multi-chip module integrated circuit

A multi-chip module semiconductor device including a plurality of IC chips arranged in a side-by-side relationship on a supporting member such as a tab is provided. Each of the IC chips is provided with an array of bonding pads for connection with the exterior of the device only along such side to w...

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Bibliographic Details
Main Author YOSHIMIZU; TOSHIKAZU
Format Patent
LanguageEnglish
Published 19.09.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A multi-chip module semiconductor device including a plurality of IC chips arranged in a side-by-side relationship on a supporting member such as a tab is provided. Each of the IC chips is provided with an array of bonding pads for connection with the exterior of the device only along such side to which no other IC chip is disposed adjacent thereto.
Bibliography:Application Number: US19930025050