Positive type photoresist composition comprising a polymer having carbon-carbon double bonds with a maleic half ester and a maleimide attached to the backbone

A positive type photoresist composition contains (a) 100 parts by weight of a resin which is a polymer compound (A) including carbon-carbon double bonds and having a molecular weight of 300 to 30,000 and an iodine value of to 500. To at least a part of the double bonds of the polymer compound (A), a...

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Bibliographic Details
Main Authors YAMASITA; YUKIO, SATO; HARUYOSHI, OTSUKI; YUTAKA, YUASA; HITOSHI, YODA; EIJI
Format Patent
LanguageEnglish
Published 02.05.1995
Edition6
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Summary:A positive type photoresist composition contains (a) 100 parts by weight of a resin which is a polymer compound (A) including carbon-carbon double bonds and having a molecular weight of 300 to 30,000 and an iodine value of to 500. To at least a part of the double bonds of the polymer compound (A), a group represented by the formula (I) is introduced (I) wherein R1 denotes a hydrogen atom, a halogen atom or an alkyl group having 1 to 3 carbon atoms and R2 denotes an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group or an aryl group, The composition further contains (b) 25 to 100 parts by weight of a compound containing a quinone diazide unit.
Bibliography:Application Number: US19910742622