Positive type photoresist composition comprising a polymer having carbon-carbon double bonds with a maleic half ester and a maleimide attached to the backbone
A positive type photoresist composition contains (a) 100 parts by weight of a resin which is a polymer compound (A) including carbon-carbon double bonds and having a molecular weight of 300 to 30,000 and an iodine value of to 500. To at least a part of the double bonds of the polymer compound (A), a...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
02.05.1995
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | A positive type photoresist composition contains (a) 100 parts by weight of a resin which is a polymer compound (A) including carbon-carbon double bonds and having a molecular weight of 300 to 30,000 and an iodine value of to 500. To at least a part of the double bonds of the polymer compound (A), a group represented by the formula (I) is introduced (I) wherein R1 denotes a hydrogen atom, a halogen atom or an alkyl group having 1 to 3 carbon atoms and R2 denotes an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group or an aryl group, The composition further contains (b) 25 to 100 parts by weight of a compound containing a quinone diazide unit. |
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Bibliography: | Application Number: US19910742622 |