Polyamides having a low water absorptivity

Thermoplastic polyamide molding materials contain, as essential components, A) from 39 to 99% by weight of a polyamide or a mixture of different polyamides and B) from 1 to 30% by weight of a phenol of the general formula I R3EI and E is a trivalent, aliphatic, C1-C10 -hydrocarbon radical, triazinet...

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Bibliographic Details
Main Authors GOETZ; WALTER, BLINNE; GERD, HURLEY; JAMES
Format Patent
LanguageEnglish
Published 25.04.1995
Edition6
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Thermoplastic polyamide molding materials contain, as essential components, A) from 39 to 99% by weight of a polyamide or a mixture of different polyamides and B) from 1 to 30% by weight of a phenol of the general formula I R3EI and E is a trivalent, aliphatic, C1-C10 -hydrocarbon radical, triazinetriyl or a trivalent C6- or C10-aryl radical, and c) from 0 to 60% by weight, based on the amount of polyamide, of fibrous or particulate fillers or a mixture thereof.
Bibliography:Application Number: US19930086461