Insulating adhesive tape, and lead frame and semiconductor device employing the tape

• Main Authors: TAGAWA; KIMITERU, KUBO; TAKAYUKI, TANABE; KENJI, MORITA; MORITSUGU, OHKAWADO; ETSUO, ABE; KENJI, MINETA; NAOSHI, KIBA; SHIGEO
• Format: Patent
• Language: English
• Published: 11.04.1995
• Edition: 6
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FIXED CONSTRUCTIONS; FOUNDATIONS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; HYDRAULIC ENGINEERING; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; SOIL SHIFTING; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

An insulating adhesive tape which comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide, wherein said thermoplastic polymer has a glass transition temperature ranging from 180 DEG C. to 280 DEG C. and an elastic modulus ranging from 1010 dyne/cm2 to 1011 dyne/cm2 at 25 DEG C., said modulus including a value ranging from 102 dyne/cm2 to 109 dyne/cm2 at a temperature between 250 DEG C. and 300 DEG C.