Fire retardant multi-layer structures comprising poly(vinyl chloride) compositions exhibiting increased adhesivity to polyamide compositions and multi-layer structures comprising the same
Improved poly(vinyl chloride) compositions which exhibit improved adhesivity to improved polyamide compositions which find particular utility in the construction of multi-layer structures, particularly for the fabrication of structures for use in forming electrical insulation structures for wires an...
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Main Author | |
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Format | Patent |
Language | English |
Published |
18.10.1994
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Edition | 5 |
Subjects | |
Online Access | Get full text |
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Summary: | Improved poly(vinyl chloride) compositions which exhibit improved adhesivity to improved polyamide compositions which find particular utility in the construction of multi-layer structures, particularly for the fabrication of structures for use in forming electrical insulation structures for wires and cables. In one useful embodiment, the multi-layer structure has in the following order: a layer of PVC and a layer of polyamide in contact with the layer of PVC wherein the layer of PVC includes a vinyl chloride containing copolymer or a terpolymer which exhibits good solubility with the PVC, and which further provides good adhesivity with the polyamide. The polyamide layer comprises an effective amount of an ethylene-bis-tetrabromophthalimide which acts as a fire retardant; the multi-layer structure exhibits good interfacial adhesion and excellent fire retardant characteristics. |
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Bibliography: | Application Number: US19910663970 |