Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof

A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer...

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Bibliographic Details
Main Authors ZIPPETELLI; PATRICK R, PAPATHOMAS; KONSTANTINOS I, SUMMA; WILLIAM J, CIBULSKY; MICHAEL J, WANG; DAVID W
Format Patent
LanguageEnglish
Published 22.02.1994
Edition5
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.
Bibliography:Application Number: US19920913101