Heat sink mounting system for semiconductor devices
A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
01.02.1994
|
Edition | 5 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink. |
---|---|
Bibliography: | Application Number: US19920894678 |