Method for molding an article integrated with a multi-layer flexible circuit and an apparatus for carrying out the method

• Main Authors: NISHIHARA; MUNEKAZU, SUETSUGU; KENICHIRO, FUKUSHIMA; TETSUO, IKEDA; JUNJI
• Format: Patent
• Language: English
• Published: 02.06.1992
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A method for molding an article integrated with a multi-layer flexible circuit by embedding the circuit in a molding material to be shaped into a certain configuration. A first flexible circuit layer is sandwiched between a fixed mold and a movable mold so as to perform an injection shaping of one side of the molding material. A plurality of flexible circuits from the second layer of flexible circuit and subsequent flexible circuits are sequentially sandwiched between the fixed mold and the movable mold and they are layered one on the other. The movable mold contains a heater. The pattern of each flexible circuit is traced with thermosetting conductive paste which is hardened by the heater of the movable mold when flexible circuits are laminated on each other. Each flexible circuit has a hot-melt type adhesive layer on the rear surface thereof. The adhesive layer is melted by the heater of the movable mold so as to place each flexible circuit layer in position when flexible circuits are laminated on each other. Through-holes are formed by punching and conductive paste is charged into the through-holes with the last layer of flexible circuit sandwiched between the fixed mold and the movable mold. Then, the injection shaping of the other side of the material is carried out.