Automated chip to board process

The invention encompasses plating to form leads to allow one step bonding of a chip to tape; one step bonding of leads on the tape to a special chip package wherein chip packages may be stacked and connected as well as surface mounted and formation of a very dense circuitry on one or both sides of a...

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Bibliographic Details
Main Authors SCHROEDER; JON M, LONG; JOSEPH F, HARTGROVE; RANDALL J
Format Patent
LanguageEnglish
Published 19.05.1992
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention encompasses plating to form leads to allow one step bonding of a chip to tape; one step bonding of leads on the tape to a special chip package wherein chip packages may be stacked and connected as well as surface mounted and formation of a very dense circuitry on one or both sides of a board by using a photo imagable dielectric to separate circuitry and allow plating thru to form integral connections and edge connectors to connect circuitry to allow use of both sides of a board.
Bibliography:Application Number: US19900617011