High resolution thermal printing device
There is disclosed a high resolution thermal printing device including a 128-bit uni-directional integrated circuit, which is specially ordered, instead of a general integrated circuit. The electrical connection of the device is achieved by wedge wire bonding employing wedges. The integrated circuit...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
17.03.1992
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Subjects | |
Online Access | Get full text |
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Summary: | There is disclosed a high resolution thermal printing device including a 128-bit uni-directional integrated circuit, which is specially ordered, instead of a general integrated circuit. The electrical connection of the device is achieved by wedge wire bonding employing wedges. The integrated circuit has a plurality of power source connecting pads which are aligned on the central portion the integrated circuit in parallel with the transverse direction thereof. |
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Bibliography: | Application Number: US19900606895 |