Direct electroplating of through holes

Substantially nonconductive or semiconductive surfaces of through-holes can be electroplated directly, without an intervening non-electrolytic metallization, by a stepwise process which includes the application to the through-holes of a polyelectrolyte surfactant in solution in combination with the...

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Main Authors APPELT; BERND K, BINDRA; PERMINDER, PARK; JAE M, EDWARDS; ROBERT D, WHITE; JAMES R, SMITH; LISA J, LOOMIS; JAMES R, REID; JONATHAN D
Format Patent
LanguageEnglish
Published 13.11.1990
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Substantially nonconductive or semiconductive surfaces of through-holes can be electroplated directly, without an intervening non-electrolytic metallization, by a stepwise process which includes the application to the through-holes of a polyelectrolyte surfactant in solution in combination with the application of a conductive metal containing material.
Bibliography:Application Number: US19890348844