Electrical component in chip structure and method for the manufacture thereof

• Main Author: OTT; GUENTER
• Format: Patent
• Language: English
• Published: 25.09.1990
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INDUCTANCES; MAGNETS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; RESISTORS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSFORMERS

At two large opposite end faces a component composed of a wafer-shaped or lamina-shaped body (1) has coatings (2, 3) and ribbon-shaped terminal elements (5, 6) and is pressure-coated with a lamina-shaped or cuboid insulating coat (7). The terminal elements (5, 6) of the component are conducted toward the outside through the insulating coat (7) at the level of the end faces of the body (1) without being bent off, the upper terminal element (5) is bent off in a downward direction and is then bent over onto the underside (19) of the insulating coat, and the lower terminal element (6) is first bent off in an upward direction, and is then arranged at the surface of the insulating coat (7) at the level of the exit location of the first terminal element (5), is then bent over by 180 DEG at this level and, lying against the terminal element (6), is bent down under the underside (19) of the insulating coat (7).