Delayed reflow alloy mix solder paste

A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilizes a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 10...

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Bibliographic Details
Main Author MCLELLAN; NEIL R
Format Patent
LanguageEnglish
Published 01.05.1990
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilizes a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.
Bibliography:Application Number: US19890384182