Composite dielectric structure for optimizing electrical performance in high performance chip support packages
The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry. This adjustment in the composite dielectric structure is accomplished by...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
10.04.1990
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry. This adjustment in the composite dielectric structure is accomplished by changes in the electrical properties of the composite dielectric material, one level being preset to a value and the other level being adjusted by alterations of predetermined amounts that depend upon the performance desired. |
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| AbstractList | The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry. This adjustment in the composite dielectric structure is accomplished by changes in the electrical properties of the composite dielectric material, one level being preset to a value and the other level being adjusted by alterations of predetermined amounts that depend upon the performance desired. |
| Author | OLSON; LEONARD T CHARSKY; RONALD S PAGNANI; DAVID P |
| Author_xml | – fullname: PAGNANI; DAVID P – fullname: OLSON; LEONARD T – fullname: CHARSKY; RONALD S |
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| Notes | Application Number: US19890375247 |
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| PublicationDate | 19900410 |
| PublicationDateYYYYMMDD | 1990-04-10 |
| PublicationDate_xml | – month: 04 year: 1990 text: 19900410 day: 10 |
| PublicationDecade | 1990 |
| PublicationYear | 1990 |
| RelatedCompanies | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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| Snippet | The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | Composite dielectric structure for optimizing electrical performance in high performance chip support packages |
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