Composite dielectric structure for optimizing electrical performance in high performance chip support packages

The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry. This adjustment in the composite dielectric structure is accomplished by...

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Bibliographic Details
Main Authors PAGNANI; DAVID P, OLSON; LEONARD T, CHARSKY; RONALD S
Format Patent
LanguageEnglish
Published 10.04.1990
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry. This adjustment in the composite dielectric structure is accomplished by changes in the electrical properties of the composite dielectric material, one level being preset to a value and the other level being adjusted by alterations of predetermined amounts that depend upon the performance desired.
Bibliography:Application Number: US19890375247