Percolating cermet thin film thermistor
A cermet thin film resistor having small particles of a refractory metal embedded in a ceramic insulator at compositions near the percolation transition. The cermets are produced by co-deposition in a dual-electron beam evaporator. The refractory metal is typically Mo or Pt. The insulator is typical...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
06.03.1990
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Subjects | |
Online Access | Get full text |
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Summary: | A cermet thin film resistor having small particles of a refractory metal embedded in a ceramic insulator at compositions near the percolation transition. The cermets are produced by co-deposition in a dual-electron beam evaporator. The refractory metal is typically Mo or Pt. The insulator is typically a Al2O3, although other insulators, for example SiO2 may be used. Deposition occurs onto a suitable substrate such as a sapphire under an oxygen environment, typically 10-5 Torr O2 with the stage heated in the range of typically 400 DEG C. Such is done to increase the size of the metallic regions. The microstructure is 10-50 ANGSTROM embedded metal in the ceramic. The resulting films are in the range of 1500 ANGSTROM thick which provides a film having a typical resistivity of 400 m OMEGA - cm which may then be patterned using lithography techniques to form two or four terminal resistors. |
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Bibliography: | Application Number: US19880253027 |