Direct interconnection for use between a semiconductor and a pin connector or the like

A direct device-to-connector interconnection includes a plurality of conductive strips affixed to a support member, each strip being cooperatively sized and aligned to establish a direct fanned out connection between a bonding pad and an external connector.

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Bibliographic Details
Main Author LANDIS; RICHARD C
Format Patent
LanguageEnglish
Published 12.09.1989
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A direct device-to-connector interconnection includes a plurality of conductive strips affixed to a support member, each strip being cooperatively sized and aligned to establish a direct fanned out connection between a bonding pad and an external connector.
Bibliography:Application Number: US19880198719