Poly-1-butene blend adhesives for laminar structure
A laminar structure comprising a substrate and a hot melt adhesive, wherein said hot melt adhesive comprises: (A) a butene-1 polymer blend of from 10% by weight of 90% by weight of an at least partially crystalline copolymer of butene-1 and ethylene, wherein the ethylene content is from about 1 mole...
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Main Author | |
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Format | Patent |
Language | English |
Published |
16.05.1989
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Subjects | |
Online Access | Get full text |
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Summary: | A laminar structure comprising a substrate and a hot melt adhesive, wherein said hot melt adhesive comprises: (A) a butene-1 polymer blend of from 10% by weight of 90% by weight of an at least partially crystalline copolymer of butene-1 and ethylene, wherein the ethylene content is from about 1 mole % to about 20 mole % of said copolymer, and from 10% by weight to 90% by weight of a butene-1 homopolymer; (B) from about 20% by weight to about 60% by weight of a substantially non-polar tackifying resin selected from the group consisting of polyterpene and aliphatic resins from C5-C9 hydrocarbon streams or hydrogenated resins thereof with softening points in the range of 70 DEG C. to 130 DEG C.; and (C) from about 0.1 phr to about 0.5 phr of an antioxidizing agent. |
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Bibliography: | Application Number: US19880239092 |