Composite substrate for integrated circuits
This invention is particularly directed to the preparation of inorganic ceramic laminated structures for use as substrates in integrated circuit packages. One lamina is composed of a high thermal conductivity material, the second lamina is composed of a low thermal conductivity material having a die...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
04.10.1988
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Edition | 4 |
Subjects | |
Online Access | Get full text |
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