Composite substrate for integrated circuits

This invention is particularly directed to the preparation of inorganic ceramic laminated structures for use as substrates in integrated circuit packages. One lamina is composed of a high thermal conductivity material, the second lamina is composed of a low thermal conductivity material having a die...

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Bibliographic Details
Main Authors WEXELL; KATHLEEN A, HOLLERAN; LOUIS M, PAISLEY; ROBERT J, MERKEL; GREGORY A
Format Patent
LanguageEnglish
Published 04.10.1988
Edition4
Subjects
BASIC ELECTRIC ELEMENTS
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
TRANSPORTING
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Summary:This invention is particularly directed to the preparation of inorganic ceramic laminated structures for use as substrates in integrated circuit packages. One lamina is composed of a high thermal conductivity material, the second lamina is composed of a low thermal conductivity material having a dielectric constant below 10, a sintering temperature below 1050 DEG C, and a linear coefficient of thermal expansion compatible with that of the other lamina, and a bonding medium sealing the two laminae together exhibiting flow at a temperature below the sintering temperature of the second lamina and a linear coefficient of thermal expansion compatible with those of the two laminae.
Bibliography:Application Number: US19870015992