Surface mounted component transport mechanism

There is herein described an improved surface mounted component (SMC) transport mechanism which accepts a multiple number of such components from a plurality of carrier media and transports them to a desired location, for example, adjacent a printed circuit board (PCB) prior to the mounting of the S...

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Bibliographic Details
Main Authors WOHLHIETER; GEORGE M, RUDOLPH; JOHN M
Format Patent
LanguageEnglish
Published 22.09.1987
Edition4
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Summary:There is herein described an improved surface mounted component (SMC) transport mechanism which accepts a multiple number of such components from a plurality of carrier media and transports them to a desired location, for example, adjacent a printed circuit board (PCB) prior to the mounting of the SMC onto the PCB.
Bibliography:Application Number: US19850800217