Printed circuit boards

A flexible, heat resistant printed circuit board which comprises a laminate of: (A) a thin-wall body having a thickness of from 3 mu m to less than 5 mm which is a cross-linked product of a mixture composed of (1) at least one of an ethylene-acrylic acid copolymer and an ethylene-methacrylic acid co...

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Bibliographic Details
Main Authors NAGATA; KAZUYA, OTANI; TAKETSUGU, MAEDA; MASAHIKO, SAITO; YASUTOKI
Format Patent
LanguageEnglish
Published 09.06.1987
Edition4
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
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Summary:A flexible, heat resistant printed circuit board which comprises a laminate of: (A) a thin-wall body having a thickness of from 3 mu m to less than 5 mm which is a cross-linked product of a mixture composed of (1) at least one of an ethylene-acrylic acid copolymer and an ethylene-methacrylic acid copolymer, and (2) a saponified product of an ethylene-vinyl acetate copolymer, wherein the mixing proportion of copolymer (1) in the mixture is from 20 to 80% by weight and the mixture is cross-linked such that after extraction of the cross-linked product with a boiled toluene for three hours the amount of residue having a size of 0.1 mu m or more is at least 80% by weight based on the weight of the cross-linked product, and (B) an electrically conductive metal layer having a thickness of from 100 ANGSTROM to 400 mu m. The boards have excellent heat resistance, electrical insulating properties, flexibility, chemical resistance, dimensional stability, etc.
Bibliography:Application Number: US19850688924