Polymethyl methacrylate compatible silicon dioxide complexing agent

An etching solution for the dissolution of silicon dioxide through a portable conformable mask, with PMMA as the etch stop layer, has been developed which eliminates resist lifting and non-uniform lateral etching, thereby providing the improved oxide edge definitions required for 1 micron line geome...

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Bibliographic Details
Main Authors BARTLETT; KEITH G, CAOLO; MARY A
Format Patent
LanguageEnglish
Published 02.04.1985
Edition3
Subjects
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Summary:An etching solution for the dissolution of silicon dioxide through a portable conformable mask, with PMMA as the etch stop layer, has been developed which eliminates resist lifting and non-uniform lateral etching, thereby providing the improved oxide edge definitions required for 1 micron line geometries in VLSI chips.
Bibliography:Application Number: US19840587348