Polymethyl methacrylate compatible silicon dioxide complexing agent
An etching solution for the dissolution of silicon dioxide through a portable conformable mask, with PMMA as the etch stop layer, has been developed which eliminates resist lifting and non-uniform lateral etching, thereby providing the improved oxide edge definitions required for 1 micron line geome...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
02.04.1985
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Edition | 3 |
Subjects | |
Online Access | Get full text |
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Summary: | An etching solution for the dissolution of silicon dioxide through a portable conformable mask, with PMMA as the etch stop layer, has been developed which eliminates resist lifting and non-uniform lateral etching, thereby providing the improved oxide edge definitions required for 1 micron line geometries in VLSI chips. |
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Bibliography: | Application Number: US19840587348 |