Thermal compensation for magnetic head assembly

Ferrite read and write modules of a magnetic head assembly that are aligned and positioned within a nonferrite housing are clamped by a leaf spring between the walls of the housing. The leaf spring compensates for thermal mismatch between the ferrite modules and the housing, and compensates for stre...

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Bibliographic Details
Main Authors CHOW; WILLIAM W, ARGUMEDO; ARMANDO J, FREEMAN; ROBERT D, KLECZKOWSKI; STAWOMIR P
Format Patent
LanguageEnglish
Published 13.12.1983
Subjects
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
PHYSICS
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Summary:Ferrite read and write modules of a magnetic head assembly that are aligned and positioned within a nonferrite housing are clamped by a leaf spring between the walls of the housing. The leaf spring compensates for thermal mismatch between the ferrite modules and the housing, and compensates for stress fluctuation that occurs with temperature change. The clamping force of the leaf spring is precisely controlled.
Bibliography:Application Number: US19810278956