Applying photoresist onto silicon wafers

Applying photoresist to silicon wafers in the manufacture of integrated circuit chips by carrying the wafers upon a rotor in a chamber and spraying from a plurality of nozzles in the chamber toward the rotor for application to the wafers.

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Bibliographic Details
Main Author BLACKWOOD; ROBERT S
Format Patent
LanguageEnglish
Published 01.09.1981
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
CINEMATOGRAPHY
ELECTROGRAPHY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
HOLOGRAPHY
MATERIALS THEREFOR
NOZZLES
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
TRANSPORTING
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Summary:Applying photoresist to silicon wafers in the manufacture of integrated circuit chips by carrying the wafers upon a rotor in a chamber and spraying from a plurality of nozzles in the chamber toward the rotor for application to the wafers.
Bibliography:Application Number: US19790060973