Nickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbon
A laminated conductor includes a lower thin film of nickel-X alloy or pseudo alloy deposited upon a substrate containing silicon or upon a substrate intended for use as a magnetic bubble storage device. Upon the film of nickel-X alloy, a thicker film of gold is deposited as the conductive portion of...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
19.05.1981
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Subjects | |
Online Access | Get full text |
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Summary: | A laminated conductor includes a lower thin film of nickel-X alloy or pseudo alloy deposited upon a substrate containing silicon or upon a substrate intended for use as a magnetic bubble storage device. Upon the film of nickel-X alloy, a thicker film of gold is deposited as the conductive portion of the conductor. On the upper surface of the gold layer is deposited a thin film of nickel-X alloy. Failure of the conductor because of electromigration is reduced dramatically as compared with use of molybdenum instead of nickel in the laminated structure. The nonmagnetic nickel-X alloy does not interfere with magnetic fields or produce unwanted magnetic fields. |
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Bibliography: | Application Number: US19790103969 |