Nickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbon

A laminated conductor includes a lower thin film of nickel-X alloy or pseudo alloy deposited upon a substrate containing silicon or upon a substrate intended for use as a magnetic bubble storage device. Upon the film of nickel-X alloy, a thicker film of gold is deposited as the conductive portion of...

Full description

Saved in:
Bibliographic Details
Main Authors POWERS; JOHN V, HO; PAUL S, MILLER; ROBERT J, AHN; KIE Y, BAJOREK; CHRISTOPHER H
Format Patent
LanguageEnglish
Published 19.05.1981
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A laminated conductor includes a lower thin film of nickel-X alloy or pseudo alloy deposited upon a substrate containing silicon or upon a substrate intended for use as a magnetic bubble storage device. Upon the film of nickel-X alloy, a thicker film of gold is deposited as the conductive portion of the conductor. On the upper surface of the gold layer is deposited a thin film of nickel-X alloy. Failure of the conductor because of electromigration is reduced dramatically as compared with use of molybdenum instead of nickel in the laminated structure. The nonmagnetic nickel-X alloy does not interfere with magnetic fields or produce unwanted magnetic fields.
Bibliography:Application Number: US19790103969