System for slicing silicon wafers

An improved system having at least one endless band saw blade characterized by a continuously regenerated cutting edge and unidirectionally driven along a pair of courses extended in mutual parallelism through a cutting station located near the midportion of said courses. The blade is supported at t...

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Bibliographic Details
Main Author COLLINS, EARL R
Format Patent
LanguageEnglish
Published 04.03.1980
Subjects
BROACHING
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS
FILING
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PLANING
SAWING
SCRAPING
SHEARING
SLOTTING
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:An improved system having at least one endless band saw blade characterized by a continuously regenerated cutting edge and unidirectionally driven along a pair of courses extended in mutual parallelism through a cutting station located near the midportion of said courses. The blade is supported at the cutting station by pairs of guides continuously rotated through less than 360 DEG of angular displacement during each cutting operation for thus continuously regenerating the blade-supporting surfaces of the guide whereby blade wobble substantially is eliminated.
Bibliography:Application Number: US19780951828