Assembly system for microcomponent devices such as semiconductor devices
An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with cond...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
04.09.1979
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Subjects | |
Online Access | Get full text |
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Summary: | An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors. |
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Bibliography: | Application Number: US19770829837 |