Light-sensitive resin composition and metal image-forming material using the same

A light-sensitive resin composition containing (a) at least one ethylenically unsaturated compound having at least two terminal ethylenically unsaturated groups, which is capable of forming a polymer through photo-addition polymerization, and which has a boiling point of about 100 DEG C. or higher a...

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Bibliographic Details
Main Authors AOTANI; YOSHIMASA, SHINOZAKI; FUMIAKI, MISU; HIROSHI, IKEDA; TOMOAKI
Format Patent
LanguageEnglish
Published 13.02.1979
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Summary:A light-sensitive resin composition containing (a) at least one ethylenically unsaturated compound having at least two terminal ethylenically unsaturated groups, which is capable of forming a polymer through photo-addition polymerization, and which has a boiling point of about 100 DEG C. or higher at atmospheric pressure, (b) an addition polymerization initiator activatable by irradiation with actinic radiation, and (c) an organic high polymer binder having water-solubilizing groups in the side chains thereof, wherein the improvement comprises the binder being a copolymer containing (A) a repeating unit derived from at least one compound selected from the group consisting of acrylic acid and methacrylic acid and (B) a repeating unit derived from at least one compound selected from the group consisting of benzyl acrylate, benzyl methacrylate, phenethyl acrylate, phenethyl methacrylate, 3-phenylpropyl acrylate, 3-phenylpropyl methacrylate, 4-phenylbutyl acrylate and 4-phenylbutyl methacrylate.
Bibliography:Application Number: US19770767865