Housing arrangement for miniaturized electronic devices
An improved miniaturized housing arrangement is disclosed for releasably mounting a chassis, such as a printed circuit board, using the contours and the resiliency of the housing itself to retain and release the board. No special tools are required nor any added hardware. The mounting arrangement ca...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
20.07.1976
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Subjects | |
Online Access | Get full text |
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Summary: | An improved miniaturized housing arrangement is disclosed for releasably mounting a chassis, such as a printed circuit board, using the contours and the resiliency of the housing itself to retain and release the board. No special tools are required nor any added hardware. The mounting arrangement captivates only small edge portions of the printed circuit board so as to avoid using valuable space on the board that may be devoted to circuitry and the like. The PC board is also fixedly connected to circuitry provided on a non-rigid base ("flex circuit"). The flex circuit is intended primarily for electrical interconnection but also provides a hinge capability for the board when the latter is released. A strain relief device releasably retains the flex circuit within the housing and prevents damage during hingeing action. |
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Bibliography: | Application Number: US19750558044 |