GRANULAR SILICONE MOLDING COMPOSITIONS

Granular silicone molding compositions consisting essentially of an organosiloxane resin whose melting point as measured by Durran's mercury method is 25 DEG to 200 DEG C, having per silicon atom an average of from 1.0 to 1.7 organic radicals directly bonded to the silicon atoms and containing...

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Bibliographic Details
Main Authors YOKOKAWA; KIYOSHI, MIZUTANI; SHIGEO, KOIZUMI; JUN
Format Patent
LanguageEnglish
Published 21.01.1975
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Granular silicone molding compositions consisting essentially of an organosiloxane resin whose melting point as measured by Durran's mercury method is 25 DEG to 200 DEG C, having per silicon atom an average of from 1.0 to 1.7 organic radicals directly bonded to the silicon atoms and containing at least 0.25% by weight, based on the organosiloxane resin, of hydroxyl radicals directly bonded to the silicon atoms; glass fibres having lengths ranging from 0.2 to 10 mm; powdery inorganic fillers; and a catalytic amount of a curing catalyst combination. The compositions impart excellent mechanical strength to molded articles made therefrom and are easily handled.
Bibliography:Application Number: US19730387037