PACKAGING
1362334 Packing materials comprising coated substrates HENKEL & CIE GmbH 30 June 1972 [3 July 1971] 30652/72 Headings C3P and C3R Heat-sealable packing materials which are permeable to air are prepared by treating a base material comprising paper, cardboard, pasteboard, corrugated cardboard or t...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
08.10.1974
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Subjects | |
Online Access | Get full text |
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Summary: | 1362334 Packing materials comprising coated substrates HENKEL & CIE GmbH 30 June 1972 [3 July 1971] 30652/72 Headings C3P and C3R Heat-sealable packing materials which are permeable to air are prepared by treating a base material comprising paper, cardboard, pasteboard, corrugated cardboard or the like, with a solution comprising a thermoplastic plastics material and an organic acicularly crystallizable compound having a M.W. of 60-148 and a melting point in excess of 130‹C and at least 30‹ C. above the activation temperature (defined) of the plastics material. Suitable crystallizable compounds are urea, phthalic anhydride, hydroquinone and succinic acid. In examples, the treating solutions comprise (1) a polyurethane (derived from adipic acid, diethylene glycol and diphenylmethane diisocyanate), ethyl acetate, methyl ethyl ketone and phthalic anhydride; and (2) butadiene/ acrylonitrile (70/30) copolymer, vinyl chloride/ vinyl acetate (85/15) copolymer, acetone, methyl ethyl ketone, acetic acid, methylene chloride, and either phthalic anhydride or hydroquinone. |
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Bibliography: | Application Number: US19720267023 |