COMPOUND SEMICONDUCTOR DEVICE HAVING UNDERCUT ORIENTED GROOVE

A compound semiconductor device is provided with at least one inwardly splayed groove by a method of etching which takes into account the crystal orientation of the semiconductor material.

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Bibliographic Details
Main Authors KOMIYA Y,JA, HARADA Y,JA, TARUI Y,JA
Format Patent
LanguageEnglish
Published 28.05.1974
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Summary:A compound semiconductor device is provided with at least one inwardly splayed groove by a method of etching which takes into account the crystal orientation of the semiconductor material.
Bibliography:Application Number: US19710137807