ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE SAME

Manufacturing of power semiconductor devices utilizing a metal strip and a lead frame. The metal strip has a plurality of portions on which semiconductor chips are mounted, and fastening means constituted by indents at the longer sides of the strip and metal pieces protruding along the indents. The...

Full description

Saved in:
Bibliographic Details
Main Authors SUZUKI J,JA, TAKEDA T,JA
Format Patent
LanguageEnglish
Published 18.12.1973
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Manufacturing of power semiconductor devices utilizing a metal strip and a lead frame. The metal strip has a plurality of portions on which semiconductor chips are mounted, and fastening means constituted by indents at the longer sides of the strip and metal pieces protruding along the indents. The lead frame has a plurality of lead units and tab portions corresponding to the indents. The lead frame is locked over the metal strip by inserting the tab portions into the corresponding indents and bending the metal pieces toward the tab portions. After encapsulating the combinations of the lead units and the portions having the chips thereon with plastic material, respectively, the metal strip and the lead frame are cut along the portions of the tab-metal piece combinations, thereby to obtain a plurality of individual power semiconductor devices.
Bibliography:Application Number: USD3778887