APPARATUS FOR PROFILING BONDING NEEDLES

In the bonding of a conductive wire to an electrical apparatus, the wire runs down through the hole in a hollow needle and extends at an angle of about 90 degrees with the needle at the tip thereof and the wire as it exits from the needle is bonded to a bonding pad comprising part of an electrical a...

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Bibliographic Details
Main Authors DA COSTA H,US, THORNTON C,US
Format Patent
LanguageEnglish
Published 30.10.1973
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MAKING NEEDLES, PINS OR NAILS OF METAL
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PUNCHING METAL
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:In the bonding of a conductive wire to an electrical apparatus, the wire runs down through the hole in a hollow needle and extends at an angle of about 90 degrees with the needle at the tip thereof and the wire as it exits from the needle is bonded to a bonding pad comprising part of an electrical apparatus by a combination of pressure and heat. If the inside and outside profiles of the tip of the hollow needle are not properly rounded, bad bonds will result in that the wire may break. Abrasive blast means are disclosed for giving the tip of the needle a proper smooth and rounded profile both internally and externally.
Bibliography:Application Number: USD3768211