SILICON-CONTAINING AMINO-PHOSPHONATES AND PROCESS OF MANUFACTURE

• Main Author: GIULIANA C. TESORO
• Format: Patent
• Language: English
• Published: 27.01.1970
• Subjects: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MINERAL OR SLAG WOOL; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; THEIR PREPARATION OR CHEMICAL WORKING-UP

1,182,718. Glass fabric laminates. J. P. STEVENS & CO. Inc. 6 Nov., 1967 [30 Dec., 1966], No. 50322/67. Heading B5N. [Also in Division C3] Superimposed layers of glass fabric, finished with a silicon-containing aminophosphate of general formula (where a is 0 or 1, m is 0 to 3, n is (3-m), R and R1 are alkyl, alkoxyalkyl, aralkyl or aryl, R2, R3 and R4 are hydrogen or alkyl, R5 is hydrogen, alkenyl, alkyl, aralkyl or aryl, R6 is a C 1 -C 6 alkyl or alkenyl group, Q is hydrogen, alkyl, aryl or -CR2R3-CHR5P(O)(OR6) 2 and Z is one or more unsubstituted or alkyl-substituted methylene groups which may be interrupted by O, S, or secondary or tertiary amino N) are impregnated with a thermosetting resin/hardener or catalyst blend and compacted under heat and pressure. The finish may be applied to the glass cloth from an aqueous dispersion and cured at elevated temperature: specified finishing compounds are diethyl 1 - [3 - (triethoxysilyl)propylamino] propylphosphonate, diethyl 1 - [3 - (triethoxysilyl)- propylamino] - 2 - butenylphosphonate, tetraethyl N - [3 - (triethoxysilyl)propyl] iminodiethylene-diphosphonate, and diethyl 2{N-[3- (trimethoxysilyl)propyl] anilino } ethylphosphonate. The thermosetting resin may be an epoxy resin or a polyester, e.g. maleic anhydride/ phthalic anhydride/propanediol.