LYOPHILIZED BEAD PRE-EMBEDDING STRUCTURE, DIGITAL MICROFLUIDIC CHIP, AND PRE-EMBEDDING AND LIQUID INJECTION METHOD

The present application provides a lyophilized bead pre-embedding structure, a digital microfluidic chip, and a pre-embedding and liquid injection method. The present application realizes normal-temperature transportation of the digital microfluidic chip, saves the transportation cost, and improves...

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Bibliographic Details
Main Authors DU, Pei, SU, Yang, ZHANG, Yan
Format Patent
LanguageEnglish
Published 24.04.2025
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Summary:The present application provides a lyophilized bead pre-embedding structure, a digital microfluidic chip, and a pre-embedding and liquid injection method. The present application realizes normal-temperature transportation of the digital microfluidic chip, saves the transportation cost, and improves the stability and reliability of chip reagent pre-embedding.
Bibliography:Application Number: US202218836068