LYOPHILIZED BEAD PRE-EMBEDDING STRUCTURE, DIGITAL MICROFLUIDIC CHIP, AND PRE-EMBEDDING AND LIQUID INJECTION METHOD
The present application provides a lyophilized bead pre-embedding structure, a digital microfluidic chip, and a pre-embedding and liquid injection method. The present application realizes normal-temperature transportation of the digital microfluidic chip, saves the transportation cost, and improves...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
24.04.2025
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Subjects | |
Online Access | Get full text |
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Summary: | The present application provides a lyophilized bead pre-embedding structure, a digital microfluidic chip, and a pre-embedding and liquid injection method. The present application realizes normal-temperature transportation of the digital microfluidic chip, saves the transportation cost, and improves the stability and reliability of chip reagent pre-embedding. |
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Bibliography: | Application Number: US202218836068 |