SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES

• Main Authors: TSENG, MING HUNG, LIN, YEN-LIANG, CHIANG, HUIUN, WU, CHENGIEH, YEH, LI-KO, LIU, JEN-FU
• Format: Patent
• Language: English
• Published: 31.10.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor structure includes a first die; a plurality of first conductive vias adjacent to the first die. The semiconductor structure further includes a plurality of second conductive vias disposed over the first conductive vias, each of the second conductive vias corresponding to one of the first conductive vias; a plurality of third conductive vias disposed over the first die; and a molding material encapsulating the first die, the first conductive vias, the second conductive vias and the third conductive vias. A first width of each of the plurality of first conductive vias, a second width of each of the plurality of second conductive vias and a third width of the plurality of third conductive vias are different from each other.