PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semicond...
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Format | Patent |
Language | English |
Published |
10.10.2024
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Abstract | The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semiconductor substrate and surround by a ring structure. A portion of the filling material is positioned between the integrated circuit and the semiconductor substrate. There are other embodiments as well. |
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AbstractList | The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semiconductor substrate and surround by a ring structure. A portion of the filling material is positioned between the integrated circuit and the semiconductor substrate. There are other embodiments as well. |
Author | Ramakrishnan, Arun Tan, Teong Swee Zhao, Sam Ziqun |
Author_xml | – fullname: Ramakrishnan, Arun – fullname: Tan, Teong Swee – fullname: Zhao, Sam Ziqun |
BookMark | eNrjYmDJy89L5WQwD3B09nZ09_RzVwiODA5x9Q1WcPRzUfB1DfHwdwlWcPMPUgh29fV09vdzCXUOAfJcXMM8nV2DeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRibGxpYmRpaOhMXGqAPQnKwk |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US2024339429A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2024339429A13 |
IEDL.DBID | EVB |
IngestDate | Fri Oct 18 05:56:33 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2024339429A13 |
Notes | Application Number: US202318296597 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241010&DB=EPODOC&CC=US&NR=2024339429A1 |
ParticipantIDs | epo_espacenet_US2024339429A1 |
PublicationCentury | 2000 |
PublicationDate | 20241010 |
PublicationDateYYYYMMDD | 2024-10-10 |
PublicationDate_xml | – month: 10 year: 2024 text: 20241010 day: 10 |
PublicationDecade | 2020 |
PublicationYear | 2024 |
RelatedCompanies | Avago Technologies International Sales Pte. Limited |
RelatedCompanies_xml | – name: Avago Technologies International Sales Pte. Limited |
Score | 3.5760448 |
Snippet | The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241010&DB=EPODOC&locale=&CC=US&NR=2024339429A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-J0SkHpW7Fr0xYfhnRJ9qG0HaYd82n0EwTphqv473spne5pb0kOQnLkd79ckrsAPOipUcRmbmtFXx7d2EauJcQhCHdkKxJnJMtlvLPn25OIvCysRQs-t7EwdZ7Qnzo5IiIqRbxXtb1e_x9isfpt5eYx-cCm1fMoHDC18Y6RjtC_UNlwwGcBC6hK6SASqv9Wy0zzCa2vi77SgdxIy0z7fD6UcSnrXVIZncLhDPsrqzNo5WUHjun277UOHHnNlTcWG_RtzsGZufTVHU_9sSLeRcg9obg-UzweTgImFPTnFCHVGvgsoiHWGJ9PKRcXcD_iIZ1oOILl34SXkdgdrnkJ7XJV5legxAUyckIsPXVsIpPD93VcCYYdG1bqJFnWhd6-nq73i2_gRFalZe7rPWhXX9_5LVJuldzVmvoF8KF-3A |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsWPqQWlb8OuTVt8GNIl3Tq3tsO0Yz6Nfg0E6Yar-O97CZvuaW9JDsIl5O7H75K7ADxqmb5IjMJqLzoidGPpRTslNkFzR7QiSU7yQuQ7-4HlxeR1Zs5q8LnNhZF1Qn9kcUS0qAztvZL-evUfxGLybeX6Kf3AoeVLP-oydcOOEY6QX6is13UnIQupSmk35mrwJmWG8Yze10GudGAjKZRkadoTeSmrXVDpn8DhBOcrq1OoFWUTGnT791oTjvzNlTc2N9a3PgN74tCRMxgGA4W_88j1ueIETPHdyAsZV5DPKVxsaxiwmEbYY-50SF1-Dg99N6JeGzWY_y14HvNddY0LqJfLsrgEJVkgIqfE1DLbIqI4fEfDk6BbiW5mdprnV9DaN9P1fvE9NLzIH8_Hw2B0A8dCJLx0R2tBvfr6Lm4Rfqv0Tu7aLwR-gcY |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=PACKAGING+SYSTEMS+AND+METHODS+FOR+SEMICONDUCTOR+DEVICES&rft.inventor=Ramakrishnan%2C+Arun&rft.inventor=Tan%2C+Teong+Swee&rft.inventor=Zhao%2C+Sam+Ziqun&rft.date=2024-10-10&rft.externalDBID=A1&rft.externalDocID=US2024339429A1 |