PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semicond...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
10.10.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semiconductor substrate and surround by a ring structure. A portion of the filling material is positioned between the integrated circuit and the semiconductor substrate. There are other embodiments as well. |
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| AbstractList | The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semiconductor substrate and surround by a ring structure. A portion of the filling material is positioned between the integrated circuit and the semiconductor substrate. There are other embodiments as well. |
| Author | Ramakrishnan, Arun Tan, Teong Swee Zhao, Sam Ziqun |
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| Snippet | The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES |
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