PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semicond...

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Bibliographic Details
Main Authors Ramakrishnan, Arun, Tan, Teong Swee, Zhao, Sam Ziqun
Format Patent
LanguageEnglish
Published 10.10.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semiconductor substrate and surround by a ring structure. A portion of the filling material is positioned between the integrated circuit and the semiconductor substrate. There are other embodiments as well.
Bibliography:Application Number: US202318296597