PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semicond...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
10.10.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semiconductor substrate and surround by a ring structure. A portion of the filling material is positioned between the integrated circuit and the semiconductor substrate. There are other embodiments as well. |
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Bibliography: | Application Number: US202318296597 |