METHOD OF ETCHING OBJECT AND ETCHING DEVICE
In a first aspect of a present inventive subject matter, a method of etching includes etching an object at a temperature that is higher than 200° C. with atomized droplets of an etching liquid.
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
26.09.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | In a first aspect of a present inventive subject matter, a method of etching includes etching an object at a temperature that is higher than 200° C. with atomized droplets of an etching liquid. |
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| AbstractList | In a first aspect of a present inventive subject matter, a method of etching includes etching an object at a temperature that is higher than 200° C. with atomized droplets of an etching liquid. |
| Author | TAKAHASHI, Isao |
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| RelatedCompanies | FLOSFIA INC |
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| Snippet | In a first aspect of a present inventive subject matter, a method of etching includes etching an object at a temperature that is higher than 200° C. with... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | METHOD OF ETCHING OBJECT AND ETCHING DEVICE |
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