SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

A semiconductor module includes an insulating sheet, a first terminal, and a second terminal that extend from inside a resin case to the outside. The first terminal is disposed on the first surface of the insulating sheet so as to overlap the insulating sheet in plan view, and includes a first tip p...

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Bibliographic Details
Main Authors MURATA, Yuma, KATO, Ryoichi, NAKAGOME, Akito
Format Patent
LanguageEnglish
Published 19.09.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor module includes an insulating sheet, a first terminal, and a second terminal that extend from inside a resin case to the outside. The first terminal is disposed on the first surface of the insulating sheet so as to overlap the insulating sheet in plan view, and includes a first tip portion that is spaced apart from the first surface in a thickness direction. The second terminal is disposed on the second surface of the insulating sheet so as to overlap the insulating sheet and first terminal in plan view, and includes a second tip portion that is spaced apart from the second surface in the thickness direction. The insulating sheet extends from inside the resin case further to the outside than do the first tip portion and the second tip portion.
Bibliography:Application Number: US202418678584